International Thesis Competition

Overview

The future is open for those who challenge reality. In the digital world, you can see, listen to and communicate with anyone and anything you want. Samsung will be with you at the center of that new world. Join us in creating the future we dream, with state-of-the-art technologies and products of Samsung.
We invite you to join us on our journey.

Applicants Requirement & related fields

College/Graduate/PhD students, young specialists, including Post-Doc researchers & non-korean, whose major relates to the following fields:

Fields	Detailed Subject
Photonics & Optics	Design and Analysis in Geometric optics/wave optics/photonics, Lighting Emitting Devices(LD/LED), Micro/adaptive Optic Devices, Optical Integration, Optics S/W, Image Signal Processing(S/W, H/W), Optical Sensor
Materials Technology	Polymer, Ceramic, Phosphor, Composites, Dielectrics, LTCC (low temperature co-fired ceramics), Nano, Dispersion, MEMS, Thin films, PCB Process, Embedded PCB, Solar Cell, Fuel Cell
RF Technology	Analog & Digital IC Design, Wireless Communication Systems, MAC Design and analysis, Network Design and Analysis, SoC for Wireless Application, Communication Software, Antenna, Wireless Audio/Video, Broadcasting
Power Technology	Power Electronics Technology for Display Power/SMPS, Power Systems for Renewable Energy Conversion & Storage, Thermal / EMI/EMC Technology for Power System, High Efficiency Topology, Control/Modeling Technology, Power Circuit Modelling and simulation Technology, Integrated Magnetics design Technology for SMPS, Slim and High Power Density Technology for Power System, Digital Power Electroncis Technology and Systems, Power ASIC Circuit Design technology
Fundamental Technology	Heat Transfer/Fluid Dynamics Simulation, Structural Deformation/Vibration simulation, Electro-magnetic Field/RF/circuit/EMI Simulation, Optics/Optical Device Simulation, Material Simulation, Molecular Modeling(quantum Physics, Molecular Dynamics, Chemical reaction), Multi-Physics Simulation, Multi-scale Simulation, Nanostructural Surface Analysis, Organic and Inorganic Chemical Analysis, Crystal Structure Analysis, Various Materials (Polymer etc.) Characterization, Laser Spectroscopy/ Metrology/ Machining, Microelectronic Reliability and Material Qualification for Microelectronic Devices, Advanced Analytical Techniques and Evaluation Methodology of Materials including SPM and an Electron Microscopy
Manufacturing Technology	Electronic Packaging and Test, Plating, MCC (Micro Contamination Control), Yield and Failure Analysis , Visually Inspection, Intelligent Control, Precision Control (Position, Velocity, Torque), Optical System Eesign and Instrumentation(for Image sensor module) , Lens Design and Molding, Nano Machining (Ultraprecision Mold & Die technology, Molding Technology for Micro/nano Structure)

Award Details

Title & Abstract Submission Deadline : 26 JUNE 2008

Estimated Schedule

Date	Contents
June  26 (Thu) 2008	Deadline for title and abstract submission
July 10 2008	Announcement of the preliminary results
Sep. 12 (Fri) 2008	Deadline for thesis submission
Oct. 02 2008	Announcemnet of the final results
Oct. 29 2008	Evaluation of theses, announcement of the final results, and distrubution of awards

Contact

Previous Winners at Russia in this competition